1、MULTIPLE INTERFACES: For RDK X3 Module Carrier Board, as the companion board for X3 modules, provides rich configurations and interfaces, including USB3.0, Ethernet, HD Multimedia Interface, MIPI CSI, MIPI DSI, 40PIN header, etc., which facilitates users' function verification and development of the modules. This enables users to verify and develop the functions of the module. 2、DIFFERENT VERSION: Version 2.0: Based on the for RDK for Linux open source package, supports the full range of for RDK X3 Pie, for X3 modules, etc. Version 1.0: for Rising Sun X3 Pie historical version, only supports for Rising Sun X3 Pie hardware, does not support new versions of for Rising Sun X3 Pie. 3、EASY TO USE: Designed for RDK X3 MD, easy to expand multiple interfaces, help development easier. 4、SUPPORT MULTIPLE DEVICES: Support access to a variety of devices, convenient for users to verify the function of the module and development. 5、NOTE: When using this software to burn, try to connect directly to the USB port of the computer, do not use external expansion, which may result in unsuccessful burning. Item Type: for RDK X3 MD Module Material: PCB Core Board Dock: for RDK X3 Module All Versions Ethernet: Gigabit Ethernet RJ45 Interface USB: USB3.0 Host Interface x 4, Micro USB 2.0 Device Interface x 1, Micro USB Interface x 1 (USB to Serial, Debugging Interface) for RPi: 40 PIN GPIO Enclosure, Compatible with for RPi 40PIN Interface; 16PIN Function Control IO Display: MIPI DSI Interface (15PIN 1.0 mm FPC Connector), HD Multimedia Interface x 1, Supports 4K 30fps Output Camera: MIPI CSI 2 Lane Interface x 2 (15PIN 1.0 mm FPC Connector), MIPI CSI 4 Lane Interface x 1 (24PIN 0.5 mm FPC Connector) Storage: Onboard Memory Card Slot (for Version Without EMMc, Supports Up to 64G) Fan Interface: Adjustable Speed, Speed Measurement, 12V Size: Approx. 99x79mm / 3.9x3.1in 1 x Module