ESP32-C3 is a safe, stable, low-power, low-cost IoT chip equipped with a RISC-V 32-bit single-core processor and supports 2.4GHz Wi-Fi and Bluetooth 5 (LE). Provide industry-leading radio frequency performance, complete security mechanisms and abundant memory resources for IoT products. ESP32-C3's dual support for Wi-Fi and Bluetooth 5 (LE) reduces the difficulty of device network configuration and is suitable for a wide range of IoT application scenarios. ESP32-C3 is equipped with a RISC-V 32-bit single-core processor with a clock frequency of up to 160 MHz. It has 22 programmable GPIO pins, built-in 400 KB SRAM, and supports multiple external flashes through SPI, Dual SPI, SPI and QPI interfaces to meet the functional requirements of various IoT products. In addition, the high temperature resistance of ESP32-C3 also makes it an Perfect choice for lighting and industrial control fields. ESP32-C3 integrates 2.4 GHz Wi-Fi and Bluetooth 5 (LE) with long-range support, helping to build IoT devices with coverage and stronger radio frequency performance. It also supports Bluetooth Mesh (Bluetooth Mesh) protocol and Espressif Systems Wi-Fi Mesh, and can still maintain excellent radio frequency performance at higher operating temperatures. ESP32-C3 supports secure boot based on -3072 algorithm and flash encryption function based on -128-XTS algorithm to secure device connection; signature module and HMAC module device identity security; Hardware accelerators supporting cryptographic algorithms devices securely transmit data on local networks and in the cloud.ESP32-C3 follows Espressif's IoT development framework ESP-IDF. ESP-IDF has successfully empowered hundreds of millions of IoT devices and has gone through a rigorous testing and release cycle. Based on its software architecture and familiarity with and tools, developers will have an easier time building ESP32-C3 applications or migrating programs. ESP32-C3 also supports working in slave mode and can provide Wi-Fi and Bluetooth LE connection functions for external host MCUs through ESP-AT and ESP-Hosted . Colour: Material:Plastic+Metal Package Contents: 1 * Development board